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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.25 no.4, 2018년, pp.9 - 15
이정현 (서울시립대학교 신소재공학과) , 정도현 (경북테크노파크 경량소재융복합기술센터) , 정재필 (서울시립대학교 신소재공학과)
This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industria...
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핵심어 | 질문 | 논문에서 추출한 답변 |
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전력반도체란? | 전력반도체(Power semiconductor)란 입력 전력을 각 전자기기에 맞게 변환 및 공급하는 역할을 하는 반도체로 파워모듈(Power module)이라고도 불리우며, IGBT (insulated gate bipolar mode transistor), MOSFET (metal oxide silicon field effect transistor), GTO (gate turn-off thermistor), 다이오드 등으로 구성되어 있다. Fig. | |
자동차 산업에 사용되는 전력반도체의 안정성 문제를 해결하기 위한 방법은? | 2-4) 특히 전기자동차 개발로 인한 수요가 크게 증가하고 있는데, 자동차 산업에 사용되는 전력반도체는 고온과 물리적 충격에 지속적으로 노출되기 때문에 안전성의 문제로 모듈내의 접합부에서는 기계적, 전기적으로 높은 신뢰성이 요구된다. 이러한 접합부의 문제를 개선하기 위하여 Au 계 솔더, Zn 계 솔더, Ag 소결법, 천이액상확산 접합 등 다양한 접합재 및 접합방법에 대한 연구가 진행되고 있다.5-12) 이 중에서 Zn 기반 접합재는 낮은 열전도도로 인해 열 손상이 발생할 수 있고, 또한 높은 융점을 지니고 있어서 접합 시 다이와 기판을 손상시킬 위험이 있다. | |
천이액상확산접합이란? | 천이액상확산접합(transient liquid phase diffusion bonding; TLP)은 1950년대에 처음 도입된 것으로, 확산접합과 브레이징을 조합한 접합 방법이다. 브레이징처럼 접합 과 정중 접합의 인터페이스에서 일시적으로 액상이 형성되지만, 접합온도를 계속 유지하면 접합재 내의 융점저하 원소들이 모재(Base metal)로 확산되면서 액상이 등온응고되면서 접합이 이루어진다. |
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