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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.26 no.4, 2019년, pp.163 - 169
박현준 (성균관대학교 신소재공학과) , 이충재 (성균관대학교 신소재공학과) , 민경득 (성균관대학교 신소재공학과) , 정승부 (성균관대학교 신소재공학과)
Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation ...
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핵심어 | 질문 | 논문에서 추출한 답변 |
---|---|---|
솔더합금이란? | 솔더합금(Solder alloy)은 전자부품들을 기계적으로 연결하고 전기적인 신호를 전달하는 역할을 하기 때문에 전자패키징 기술에서 필수적인 핵심소재이다. 종래의 솔더 합금으로는 SnPb계 합금이 우수한 젖음성과 낮은 융점 그리고 저렴한 가격 때문에 가장 널리 사용되었다. | |
CNT의 분류는 어떻게 되는가? | CNT는 1991년 Iijima 등에 15) 의해 발견된 탄소의 동소 체로 원기둥 형태의 나노구조이며, 벽의 결합 숫자에 따라 단중벽 탄소나노튜브(single walled carbon nanotube, SWCNT)과 다중벽 탄소나노튜브(multi walled carbon nanotube, MWCNT)로 분류된다. MWCNT는 최근 대량 생산기술의 확보로 인해 가격이 저렴하여 복합솔더 (composite solder)의 제조에서 강화상으로 사용될 수 있는 가능성을 높였다. | |
솔더합금과 MWCNT를 이용하여 복합솔더를 제조할 때 발생하는 문제점은? | 14,16,17) 그러나, 솔더합금과 MWCNT 는 화학적, 물리적 물성차이가 존재하므로 복합솔더를 제조할 때 다양한 문제점이 발생한다. 예를 들어, MWCNT 와 솔더합금은 화학적으로 결합하지 않기 때문에 약한 원자 간의 힘인 Van der Waals 힘으로 결합이 유지될 뿐만 아니라, 18) 두 재료 간의 밀도차이로 인하여 솔더내부에 MWCNT 입자를 균일하게 분산하는 것이 매우 어렵다. |
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