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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.2, 2021년, pp.29 - 37
최성훈 (안동대학교 신소재공학부 청정에너지소재기술연구센터) , 김가희 (안동대학교 신소재공학부 청정에너지소재기술연구센터) , 서한결 (서울과학기술대학교 나노IT디자인융합대학원) , 김사라은경 (서울과학기술대학교 나노IT디자인융합대학원) , 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)
The effect of Ar/N2 two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N2 2-step plasma treatment has less copper oxide due to the formation of...
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