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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.3, 2022년, pp.37 - 42
엄희진 (한양대학교 융합기계공학과) , 황연택 (한양대학교 융합기계공학과) , 김학성 (한양대학교 융합기계공학과)
Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are wide...
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