$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

솔더 합금 종류 및 솔더 조인트의 신뢰성 평가 기법
Solder Alloy Types and Solder Joint Reliability Evaluation Techniques 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.30 no.1, 2023년, pp.17 - 29  

김유권 (한양대학교 융합기계공학과) ,  김헌수 (한양대학교 융합기계공학과) ,  김태완 (한양대학교 융합기계공학과) ,  김학성 (한양대학교 융합기계공학과)

초록
AI-Helper 아이콘AI-Helper

본 논문에서는 전자제품의 소형화와 고성능화에 따라 패키징 기술에서 핵심적인 역할을 하는 솔더 조인트의 신뢰성 평가 방법을 소개한다. 우선, 다양한 합금 조성과 제품 형태에 따른 솔더의 특성을 설명하고, 여러 패키지에서의 솔더 조인트 구조에 대한 개요를 제시한다. 그 다음 솔더 합금의 조성과 미시구조가 솔더의 열적 및 기계적 특성에 미치는 영향을 분석하며, 솔더 크리프 거동에 대해 간략히 소개한다. 이어서, 신뢰성 평가를 위한 크리프 모델과 피로 모델 등을 고려한 분석 기법들을 소개하고, 솔더 조인트의 신뢰성을 향상시킬 수 있는 방안에 대해 논의한다. 본 연구는 반도체 패키징 기술 분야에서 솔더 조인트의 신뢰성 평가와 개선에 유익한 정보를 제공할 것으로 기대된다.

Abstract ▼ AI-Helper 아이콘AI-Helper

In this paper, a method for evaluating the reliability of solder joints is introduced, as they play a crucial role in packaging technology due to the miniaturization and high-performance requirements of electronic device. Firstly, properties of solder based on various alloy compositions and solder t...

주제어

#Package   #Solder joint reliability   #Creep model   #Fatigue model   #Microstructure  

표/그림 (12)

참고문헌 (48)

  1. 한국과학기술기획평가원 (KISTEP) 기술동향브리프, 반도체？후공정 (패키징), (2020). 

  2. X. Zha, Numerical analysis of lead-free solder joints: Effects？of thermal cycling and electromigration. Diss. Loughborough？University, (2016). 

  3. S.-K. Kang, D.-Y. Shih, and W. E. Bernier, "Flip-chip interconnections: past, present, and future", Advanced Flip Chip？Packaging, 85-154, (2013). 

  4. W. H. Zhong, Y. C. Chan, M. O. Alam, B. Y. Wu, and J. F.？Guan, "Effect of multiple reflow processes on the reliability？of ball grid array (BGA) solder joints", Journal of Alloys and？Compounds, 414(1-2), 123-130 (2006). 

  5. J.-H. Lee, N.-H. Kang, C.-W. Lee, and J.-H. Kim, "Necessity？of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys", Journal of KWS, 24(2),？17-28 (2006). 

  6. C. Basaran and J. Jiang, "Measuring intrinsic elastic modulus？of Pb/Sn solder alloys", Mechanics of Materials, 34(6), 349-？362 (2002). 

    상세보기 crossref

  7. H. Tang and C. Basaran, "Influence of microstructure coarsening on thermomechanical fatigue behavior of Pb/Sn eutectic？solder joints", International Journal of Damage Mechanics,？10(3), 235-255 (2001). 

    상세보기 crossref

  8. T. R. Bieler, H. Jiang, L. P. Lehman, T. Kirkpatrick, E. J.？Cotts, and B. Nandagopal, "Influence of Sn grain size and orientation on the thermomechanical response and reliability of？Pb-free solder joints", IEEE Transactions on Components and？Packaging Technologies, 31(2), 370-381 (2008). 

    상세보기

  9. B. Wu, Y.-H. Yang, B. Han, and J. Schumacher, "Measurement of anisotropic coefficients of thermal expansion of？SAC305 solder using surface strains of single grain with arbitrary orientation", Acta Materialia, 156, 196-204 (2018). 

    상세보기 crossref

  10. W. Dong, Y. Shi, et al. "Effects of trace amounts of rare earth？additions on microstructure and properties of Sn-Bi-based solder alloy", Journal of Electronic Materials, 37, 982-991 (2008). 

    상세보기 crossref

  11. Z. Wang, Q. K. Zhang, et al., "Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints", Journal of Materials Science: Materials in Electronics, 30, 18524-？18538 (2019). 

    상세보기 crossref

  12. H.-J Kang, B.-G Baek, and J.-P Jung, "Recent Low Temperature Solder of SnBi and Its Bonding Characteristics", Journal？of Welding and Joining, 38(6), 576-583 (2020). 

  13. B. P. Kashyap and G. S. Murty, "Experimental constitutive？relations for the high temperature deformation of a Pb Sn？eutectic alloy", Materials Science and Engineering, 50(2),？205-213 (1981). 

    상세보기 crossref

  14. K. Mishiro, S. Ishikawa, M. Abe, and T. Kumai, "Effect of？the drop impact on BGA/CSP package reliability", Microelectronics Reliability, 2(1), 77-82 (2002). 

  15. M. Amagai, "Chip scale package (CSP) solder joint reliability？and modeling", Microelectronics Reliability, 9(4), 463-477？(1999). 

  16. X. Fan, "Wafer level packaging (WLP): fan-in, fan-out and？three-dimensional integration", 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE),？IEEE, (2010). 

  17. P. H. Wang, Y. C. Lee, C. K. Lee, et al., "Solder joint reliability assessment and pad size studies of FO-WLP with glass？substrate", IEEE Transactions on Device and Materials Reliability, 1(1), 96-101 (2021). 

  18. J. S Hwang, "Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and？component assembly", Springer Science & Business Media？(2012). 

  19. J.-W. Kim and S.-B. Jung, "Reexamination of the solder ball？shear test for evaluation of the mechanical joint strength",？International Journal of Solids and Structures, 3(7-8), 1928-？1945 (2006). 

  20. P. Hackes, A. F. Sprecher, and H. Conrad, "Computer simulation of thermo-mechanical fatigue of solder joints including？microstructure coarsening", J. Electron. Packag., 115(2), 153-？158 (1993). 

    상세보기 crossref

  21. L. Anand, "Constitutive equations for hot-working of metals",？International Journal of plasticity, 1(3), 213-231 (1985). 

    상세보기 crossref

  22. S.-B. Brown, K.-H. Kim, and L. Anand, "An internal variable？constitutive model for hot working of metals", International？journal of plasticity, 5(2), 95-130 (1989). 

    상세보기

  23. T. Y. Pan, " Thermal Cycling Induced Plastic Deformation in？Solder Joints-Part I: Accumulated Deformation in Surface？Mount Joints", J. Electron. Packag., 113(1), 8-15 (1991). 

    상세보기 crossref

  24. R. Darveaux and K. Banerji, "Fatigue analysis of flip chip？assemblies using thermal stress simulations and a CoffinManson relation", 1991 Proceedings 41st Electronic Components & Technology Conference., IEEE (1991). 

  25. X. Q. Shi, Z. P. Wang, Q. J. Yang, and H. L. J. Pang, "Creep？behavior and deformation mechanism map of Sn-Pb eutectic？solder alloy", J. Eng. Mater. Technol., 125(1), 81-88 (2003). 

    상세보기 crossref

  26. Y. Lee, and C. Basaran, "A creep model for solder alloys",？J. Electron. Packag., 133(4), 044501 (2011). 

    상세보기

  27. E. Komurlu, A. Kesimal, and A. D Demir, "Dog bone shaped？specimen testing method to evaluate tensile strength of rock？materials", Geomechanics and Engineering, 12(6), 883-898？(2017). 

    상세보기 crossref

  28. L. S. Kamaruzzaman, Y. Goh, "Microstructure and tensile？properties of Sn-Bi-Co solder alloy", Journal of Materials？Science: Materials in Electronics, 34(4), 312 (2023). 

    상세보기

  29. Y. Wang, I. M. D. Rosa, and K.-N. Tu, "Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints", 2015 IEEE？65th Electronic Components and Technology Conference？(ECTC), IEEE (2015). 

  30. P. Darbandi, T. R. Bieler, F. Pourboghrat, and T. Lee, "The？effect of cooling rate on grain orientation and misorientation？microstructure of SAC105 solder joints before and after？impact drop tests", Journal of Electronic Materials, 43, 2521-？2529 (2014). 

    상세보기 crossref

  31. Z. L. Ma, S. A. Belyakov, and C. M. Gourlay, "Effects of？cobalt on the nucleation and grain refinement of Sn-3Ag-0.5？Cu solders", Journal of Alloys and Compounds, 682, 326-337？(2016). 

    상세보기 crossref

  32. Y. Zhang, Z. Cai, et al., "The effects of aging temperature on？SAC solder joint material behavior and reliability", 2008 58th？Electronic Components and Technology Conference, IEEE,？(2008). 

  33. X. J. Wang, Z. G. Wang, and J. K. Shang, "Effect of displacement rate on lap shear test of SAC solder ball joints", 2008？International Conference on Electronic Packaging Technology？& High Density Packaging, IEEE (2008). 

  34. D. Herkommer, J. Punch, and M. Reid, "Constitutive modeling of joint-scale SAC305 solder shear samples", IEEE？Transactions on Components, Packaging and Manufacturing？Technology, 3(2), 275-281 (2012). 

  35. S. M. K. Hasan, M. AI. Ahsan, et al., "Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to？Different Thermal Exposure Profiles", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),？IEEE, (2022). 

  36. J. H. L. Pang, B. S. Xiong, and T. H. Low, "Creep and fatigue？characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder",？2004 proceedings. 54th electronic components and technology conference (IEEE Cat. No. 04CH37546) (2004). 

  37. J. A. Depiver, S. Mallik, and E. H. Amalu, "Thermal fatigue？life of ball grid array (BGA) solder joints made from different？alloy compositions", Engineering Failure Analysis, 125,？105447 (2021). 

    상세보기

  38. L. Jiang, W. Zhu, and H. He, "Comparison of darveaux model？and coffin-manson model for fatigue life prediction of bga？solder joints", 2017 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE (2017). 

  39. J. Li, H. Xu, J. Hokka, T. T. Mattila, et al., "Finite element？analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests", Soldering & Surface Mount？Technology, 23(3), 161-167 (2011). 

    상세보기

  40. B. Qiu, J. Xiong, H. Wang, S. Zhou, et al., "Survey on Fatigue？Life Prediction of BGA Solder Joints", Electronics, 11(4), 542？(2022). 

  41. P. Paris and F. Erdogan, "A critical analysis of crack propagation laws", J. Fluids Eng., 85(4), 528-533 (1963). 

  42. A. Lakshminarayana, A. Misrak, et al., "Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on？Reliability of WCSP Packages Under Drop Test", 2020 IEEE？70th Electronic Components and Technology Conference？(ECTC), IEEE, (2020). 

  43. J. Gao and J. B. Kwak, "Reliability and thermal fatigue life？prediction of solder joints for advanced automotive microelectronics", Journal of Mechanical Science and Technology,？35, 3633-3641 (2021). 

    상세보기

  44. D.-H. Park and T.-S. Oh, "Reliability Characteristics of a？Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test",？Journal of the Microelectronics and Packaging Society, 23(3),？43-49 (2016). 

    원문보기 상세보기 crossref

  45. H. Chen, Y. Liu, S. Zhang, et al., "Effects of Sn-Ag-x leveling？layers on the microstructure and shear behavior of Sn-58Bi？solder joint under thermal cycling", Journal of Materials Science: Materials in Electronics, 34(3), 223 (2023). 

    상세보기

  46. W. Liu and N.-C. Lee, "The effects of additives to SnAgCu？alloys on microstructure and drop impact reliability of solder？joints", JOM 59, 26-31 

  47. R. Khazaka, L. Mendizabal, et al., "Survey of high-temperature reliability of power electronics packaging components",？IEEE Transactions on power Electronics, 30(5), 2456-2464？(2014). 

    상세보기 crossref

  48. J. Gong, "Microstructural features and mechanical behaviour？of lead free solders for microelectronic packaging", Diss.？Loughborough University, (2007).？ 

저자의 다른 논문 :

관련 콘텐츠

오픈액세스(OA) 유형

GOLD

오픈액세스 학술지에 출판된 논문

이 논문과 함께 이용한 콘텐츠

저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로