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NTIS 바로가기IEEE microwave and wireless components letters : a publication of the IEEE Microwave Theory and Techniques Society, v.22 no.8, 2012년, pp.403 - 405
Myunghoi Kim (Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea) , Kyoungchoul Koo (Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea) , Joungho Kim (Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea) , Jiseong Kim (Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea)
In this letter, we propose a vertical inductive bridge electromagnetic bandgap (VIB-EBG) structure for size reduction of a unit cell and the wideband suppression of simultaneous switching noise (SSN) in a multi-layer package. With the proposed vertical inductive bridge, the inductance of an EBG unit...
Wang, Chien-Lin, Shiue, Guang-Hwa, Guo, Wei-Da, Wu, Ruey-Beei. A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers. IEEE transactions on microwave theory and techniques, vol.54, no.12, 4209-4217.
Wu, Tzong-Lin, Wang, Chien-Chung, Lin, Yen-Hui, Wang, Ting-Kuang, Chang, G.. A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits. IEEE microwave and wireless components letters : a publication of the IEEE Microwave Theory and Techniques Society, vol.15, no.3, 174-176.
Lee, Junho, Kim, Hyungsoo, Kim, Joungho. High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions. IEEE microwave and wireless components letters : a publication of the IEEE Microwave Theory and Techniques Society, vol.15, no.8, 505-507.
Wu, Tzong-Lin, Lin, Yen-Hui, Chen, Sin-Ting. A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures. IEEE microwave and wireless components letters : a publication of the IEEE Microwave Theory and Techniques Society, vol.14, no.7, 337-339.
Rao, P. H., Swaminathan, M.. A Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation. IEEE transactions on electromagnetic compatibility, vol.53, no.4, 996-1004.
Rajo-Iglesias, Eva, Inclan-Sanchez, Luis, Vazquez-Roy, Jose-Luis, Garcia-Munoz, Enrique. Size Reduction of Mushroom-Type EBG Surfaces by Using Edge-Located Vias. IEEE microwave and wireless components letters : a publication of the IEEE Microwave Theory and Techniques Society, vol.17, no.9, 670-672.
Jinwoo Choi, Govind, V., Swaminathan, M., Bharath, K.. Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN). IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society, vol.33, no.1, 2-12.
Tzong-Lin Wu, Hao-Hsiang Chuang, Ting-Kuang Wang. Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation. IEEE transactions on electromagnetic compatibility, vol.52, no.2, 346-356.
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