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IEEE transactions on components, packaging, and manufacturing technology, v.4 no.8, 2014년, pp.1380 - 1390
Ellis, Charles D. (Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA) , Hamilton, Michael C. (Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA) , Nakamura, James R. (Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA) , Wilamowski, Bogdan M. (Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA)
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Determination of copper electroplating additives is critical to ensuring consistent copper plating of conductors and through-silicon-vias used in semiconductor processing and electronics packaging. The present analysis methods require many chemical analysis steps, generate waste, and are not very ac...
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