최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
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NTIS 바로가기Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the, 2017 July, 2017년, pp.1 - 3
Fan, Chunyan (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203) , Duan, Shuqing (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203) , Li, Ming (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203) , Han, May (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203) , Chen, Liu (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203) , Zhang, Mark (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203) , Chien, Wei-Ting Kary (Semiconductor Manufacturing International Corp., 18 Zhangjiang Rd., Pudong New Area, Shanghai 201203)
This paper reports three new delayer methods for TEM sample preparation with the benefit to locate the region of interest rapidly and efficiently. The experimental results showed that these methods can help to minimize the cycle time, decrease the cost and improve the sample quality....
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