초록 ▼

An automated soldering technique and device are provided that are robust and reliable. A laser is used to heat metallic components to be soldered, and a wavelength of the laser is chosen based in light absorption characteristics of the metallic components. The laser wavelength can be, for example, a

An automated soldering technique and device are provided that are robust and reliable. A laser is used to heat metallic components to be soldered, and a wavelength of the laser is chosen based in light absorption characteristics of the metallic components. The laser wavelength can be, for example, about 825 nanometers. A soldering location at which the laser forms a beam spot is located at a predetermined distance away from a focus of the laser beam, so that the beam spot is defocused and has a uniform intensity across its area. The beam spot can be sized to simultaneously encompass a plurality of solder joint locations. The beam spot size and path across a plurality of solder joint locations are selected so that those portions of the solder joint locations which are touched by the beam have the same heat sinking properties. A camera is also provided coaxially with the laser beam, and a dichroic prism is positioned between the laser beam and the camera. The dichroic prism deflects laser light toward the soldering location, and passes visible light from the soldering location to the camera.

대표청구항 ▼

[ What is claimed is:] [1.]1. A device for soldering metallic components, comprising:a laser for providing a beam to heat the metallic components and having a wavelength selected based on light absorption characteristics of the metallic components; anda defocusing mechanism for defocusing the beam t

[ What is claimed is:] [1.]1. A device for soldering metallic components, comprising:a laser for providing a beam to heat the metallic components and having a wavelength selected based on light absorption characteristics of the metallic components; anda defocusing mechanism for defocusing the beam to provide a beam spot having an effectively uniform energy density at a soldering location that is located at a predetermined distance away from a focus of the beam.