Jung, Dong Yun
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
,
Jang, Hyun Gyu
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
,
Kim, Minki
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
,
Park, Junbo
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
,
Jun, Chi-Hoon
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
,
Park, Jong Moon
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
,
Ko, Sang Choon
(ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
We propose a substrate with high thermal conductivity, manufactured by the low-temperature co-fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter us...
We propose a substrate with high thermal conductivity, manufactured by the low-temperature co-fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC- and PCB-based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC-based converter, two types of tests were conducted. Storage temperature tests were conducted at -20 ℃ and 85 ℃ for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 ℃ without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.
We propose a substrate with high thermal conductivity, manufactured by the low-temperature co-fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC- and PCB-based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC-based converter, two types of tests were conducted. Storage temperature tests were conducted at -20 ℃ and 85 ℃ for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 ℃ without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.
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문제 정의
This paper discusses the applicability of a substrate with high thermal conductivity fabricated with LTCC process technology as a new DC/DC converter platform in power electronics applications. It also details the design of a 48‐ to‐12 V converter, provides an efficiency comparison to four other converters, and describes the results of a reliability test of the proposed LTCC‐based nonsynchronous buck converter.
제안 방법
This paper discusses the applicability of a substrate with high thermal conductivity fabricated with LTCC process technology as a new DC/DC converter platform in power electronics applications. It also details the design of a 48‐ to‐12 V converter, provides an efficiency comparison to four other converters, and describes the results of a reliability test of the proposed LTCC‐based nonsynchronous buck converter. The following four types of converters are designed and discussed in this paper:
Storage temperature tests were conducted to compare the efficiency under normal operating conditions before and after storage in a chamber at −20 °C and 85 °C, respectively, during a 100‐h period.
To verify the reliability of the LTCC based converter, two types of tests were conducted on the Type III converter: two storage temperature tests and a working temperature test. Storage temperature tests were conducted to compare the efficiency under normal operating conditions before and after storage in a chamber at −20 °C and 85 °C, respectively, during a 100‐h period.
It was observed that as the output power increases, the difference in efficiency of the proposed LTCC‐ and conventional PCB‐based converters increases owing to the increase in heat generation. Storage temperature and working temperature tests were carried out to evaluate thermal reliability. The LTCC substrate exhibited outstanding thermal reliability, which is approximately 10 times higher than that of a traditional PCB substrate.
대상 데이터
A GaN‐based FET and Schottky barrier rectifier (SBR) are used as the power switch and freewheeling diode, respectively. We used an LM5088 as the PWM controller. The output of the LM5088 is fed to an LM5113 used as a gate driver.
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