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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.4, 2021년, pp.19 - 23
A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Al...
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