참고문헌 (16)

1. C. Perabo, "How is a high quality solder sphere made? : Solder Ball Diameter & Spheroid Tolerance", CAPLINQ blog. https://www.caplinq.com/blog/solder-sphere-diameter-and-spheroid-tolerance_830/ (2014). 

2. "Solder Ball Issues of BGA Components and How to Avoid Them", PCBCART Article https://www.pcbcart.com/article/content/solder-ball-issues-of-bga-components.html (2005). 

3. 박영순, 김준식, "A Study on the Vision Inspection System for the Defects Detection of Micro-BGA Device", J. Korean Precision Engineering, 24, pp.44 (2007). 

4. Z. Feng, J. C. Gonzalez, S. Tang, M. Kurwa and E. Krastev, "Non-destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX, and Cross-section/SEM Comparison", Proc. SMTA International Conference, Orlando, USA (2008). 

5. X. Zhou, J. Zhou, G. Tian and Y. Wang, "Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography", Sensors, 15 (2015). 

6. 허경무, "정확도를 향상시킨 BGA 솔더볼 외관검사 기법 개발" 전자공학회 논문지 제47권 SC편 제6호 (2010). 

7. Z. Zhang, S. Huang, N. Gao1, F. Gao, X. Jiang, "Full-Field 3D Shape Measurement of Specular Object Having Discontinuous Surfaces", Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 104490T (2017). 

8. 김민영, "마이크로 BGA 패키지의 볼 형상 시각검사를 위한 모아레 간섭계 기반 3차원 머신 비젼 시스템", 마이크로전자및패키징학회지, v.19, no.1, pp.81 (2012). 

   원문보기 상세보기

9. J. H. Kim, C. D. Nguyen, "Shape Recognition of a BGA Ball using Ring Illumination", Journal of Institute of Control, Robotics and Systems, 19, 960-967 (2013). 

10. K. W. Ko, H. S. Cho, "Solder Joint Inspection Using a Neural Network and Fuzzy Rule-Based Classification Method", IEEE Tr. Electronic Packaging Manufacturing, 23, pp.93 (2000). 

    상세보기

11. 김지홍, "LED 반사영상을 이용한 마이크로 BGA 3차원형상 검사", J. Microelectron. Packag. Soc., 24(2), 1-5 (2017). 

    원문보기 상세보기

12. S. F. Chen,"An Optical Inspection System for the Solder Balls of BGA using Support Vector Machine Classification", Proceedings of the Sixth International Conference on Machine Learning and Cybernetics, IEEE, (19-22). Hong Kong (2007). 

13. G. Fontana, S. Ruggeri, I. Fassi, G. Legnani, "Strategies for micro-handling of solder balls for the automated reballing of BGA packages", 4M/IWMF 4th congress on Micro and Nano Manufacturing No.731 (2016). 

14. M. Klammer and D. Durhammer, "Measuring 17,360 solder balls per second" Imaging & Machine Vision Europe 11 (2020). 

15. Y. C. Lin, K. Wang, "Position Determination of A Ball Grid Array by Automated Optical Inspection Method", Proceedings of the 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (pp. 97-101), Hawaii (2014). 

16. L. Bai, X. Yang, H. Gao, "A Novel Coarse-Fine Method for Ball Grid Array Component Positioning and Defect Inspection" Transactions On Industrial Electronics, Vol. 65, No. 6 (2018). 

저자의 다른 논문 :

김지홍 (3)