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Recent Advances in a-IGZO Thin Film Transistor Devices: A Short Review 원문보기

전기전자재료학회논문지 = Journal of the Korean institute of electronic material engineers, v.36 no.5, 2023년, pp.463 - 473  

Jingwen Chen (Department of Electrical and Computer Engineering, Sungkyunkwan University) ,  Fucheng Wang (Department of Electrical and Computer Engineering, Sungkyunkwan University) ,  Yifan Hu (Department of Electrical and Computer Engineering, Sungkyunkwan University) ,  Jaewoong Cho (Department of Electrical and Computer Engineering, Sungkyunkwan University) ,  Yeojin Jeong (Department of Electrical and Computer Engineering, Sungkyunkwan University) ,  Duy Phong Pham (Department of Electrical and Computer Engineering, Sungkyunkwan University) ,  Junsin Yi (College of Information and Communication Engineering, Sungkyunkwan University)

Abstract AI-Helper 아이콘AI-Helper

In recent years, the transparent amorphous oxide thin film transistor represented by indium-gallium-zinc-oxide (IGZO) has become the first choice of the next generation of integrated circuit control components. This article contributes an overview of IGZO thin-film transistors (TFTs), including thei...

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표/그림 (11)

참고문헌 (47)

  1. J. Liu, R. Liu, S. Zhan, Q. Luo, R. Chen, and X. Cheng, IEEE?Trans. Electron Devices, 70, 1682 (2023).?doi: https://doi.org/10.1109/ted.2023.3241572 

  2. J. Y. Kwon, D. J. Lee, and K. B. Kim, Electron. Mater. Lett., 7,?1 (2011).?doi: https://doi.org/10.1007/s13391-011-0301-x 

  3. Y. Zhu, Y. He, S. Jiang, L. Zhu, C. Chen, and Q. Wan, J.?Semicond., 42, 031101 (2021).?doi: https://doi.org/10.1088/1674-4926/42/3/031101 

  4. K. Nomura, H. Ohta, K. Ueda, T. Kamiya, M. Hirano, and H.?Hosono, Science, 300, 1269 (2003).?doi: https://doi.org/10.1126/science.1083212 

  5. S. Knobelspies, B. Bierer, A. Daus, A. Takabayashi, G. A.?Salvatore, G. Cantarella, A. O. Perez, J. Wollenstein, S. Palzer,?and G. Troster, Sensors, 18, 358 (2018).?doi: https://doi.org/10.3390/s18020358 

  6. Q. Z. Chen, C. Y. Shi, M. J. Zhao, P. Gao, W. Y. Wu, D. S. Wuu,?R. H. Horng, S. Y. Lien, and W. Z. Zhu, IEEE Electron Device?Lett., 44, 448 (2023).?doi: https://doi.org/10.1109/led.2023.3239379 

  7. C. H. Wu, S. K. Mohanty, B. W. Huang, K. M. Chang, S. J.?Wang, and K. J. Ma, Nanotechnology, 34, 175202 (2023).?doi: https://doi.org/10.1088/1361-6528/acb5f9 

  8. Z. Cao, X. Huo, Q. Ma, J. Song, Q. Pan, L. Chen, J. Lai, X. Shan,?and J. Gao, Sens. Actuators, B, 385, 133685 (2023).?doi: https://doi.org/10.1016/j.snb.2023.133685 

  9. J. Choi, J. Cho, H. Kim, S. Jeong, T. Kim, S. K. Dhungel, Y.?Kim, J. K. Song, Y. S. Kim, and D. P. Pham, ECS J. Solid State?Sci. Technol., 12, 034001 (2023).?doi: https://doi.org/10.1149/2162-8777/acbedd 

  10. C. Liu, H. Zhou, Z. Jiang, and H. Xu, Proc. 2019 IEEE 2nd?International Conference on Electronics Technology (ICET)?(IEEE, Chengdu, China, 2019) p. 354.?doi: https://doi.org/10.1109/ELTECH.2019.8839489 

  11. G. Packard, R. G. Manley, and K. D. Hirschman, ECS Trans.,?90, 79 (2019).?doi: https://doi.org/10.1149/09001.0079ecst 

  12. S. Lee, J. S. Park, and Y. Hong, J. Korean Phys. Soc., 77, 277?(2020).?doi: https://doi.org/10.3938/jkps.77.277 

  13. M. Moreno, A. Ponce, A. Galindo, E. Ortega, A. Morales, J.?Flores, R. Ambrosio, A. Torres, L. Hernandez, H. Vazquez-Leal,?G. Patriarche, and P.R.I. Cabarrocas, Materials, 14, 6947 (2021).?doi: https://doi.org/10.3390/ma14226947 

  14. H. Xu, G. Wan, J. Mai, Z. Jiang, B. Liu, and S. Zhang, Semicond.?Sci. Technol., 38, 035006 (2023).?doi: https://doi.org/10.1088/1361-6641/acb2e8 

  15. Y. Zhang, J. Li, J. Li, T. Huang, Y. Guan, Y. Zhang, H. Yang,?M. Chan, X. Wang, L. Lu, and S. Zhang, IEEE Electron Device?Lett., 44, 444 (2023).?doi: https://doi.org/10.1109/led.2023.3237747 

  16. T. Anutgan and M. Anutgan, IEEE Trans. Electron Devices, 68,?6182 (2021).?doi: https://doi.org/10.1109/ted.2021.3119540 

  17. C. W. Kuo, T. C. Chang, J. J. Chen, K. J. Zhou, and T. M. Tsai,?IEEE Trans. Electron Devices, 69, 6789 (2022).?doi: https://doi.org/10.1109/ted.2022.3217246 

  18. C. Wang, C. Peng, P. Wen, M, Xu, L. Chen, X. Li, and J. Zhang,?IEEE Trans. Electron Devices, 70, 1687 (2023).?doi: https://doi.org/10.1109/ted.2023.3244903 

  19. H. M. Ahn, S. H. Moon, Y. H. Kwon, N. J. Seong, K. J. Choi,?C. S. Hwang, J. H. Yang, Y. H. Kim, and S. M. Yoon, IEEE?Electron Device Lett., 43, 1909 (2022).?doi: https://doi.org/10.1109/led.2022.3210162 

  20. S. H. Moon, S. H. Bae, Y. H. Kwon, N. J. Seong, K. J. Choi, and?S. M. Yoon, Ceram. Int., 48, 20905 (2022).?doi: https://doi.org/10.1016/j.ceramint.2022.04.082 

  21. Y. F. Tu, C. L. Chiang, T. C. Chang, Y. H. Hung, L. C. Sun, C.?W. Kuo, H. Y. Tu, H. C. Huang, and C. H. Lien, IEEE Trans.?Electron Devices, 69, 3181 (2022).?doi: https://doi.org/10.1109/ted.2022.3166745 

  22. S. K. Kim, Y. J. Choi, S. I. Cho, K. S. Cho, and J. Jang, SID?Symp. Dig. Tech. Pap., 29, 379 (1998).?doi: https://doi.org/10.1889/1.1833771 

  23. J. Park, S. Choi, S. J. Myoung, J. Y. Kim, C. Kim, S. J. Choi, D.?M. Kim, J. H. Bae, and D. H. Kim, IEEE Electron Device Lett.,?44, 96 (2023).?doi: https://doi.org/10.1109/led.2022.3225838 

  24. H. Xie, Ph.D. Mechanism Investigation and Process?Development of Nitrogen-Doped Amorphous Oxide Semiconductor?Thin Film Transistors, Dissertation Submitted to Shanghai Jiao?Tong University, 2018. 

  25. F. M. Hossain, J. Nishii, S. Takagi, A. Ohtomo, T. Fukumura,?H. Fujioka, H. Ohno, H. Koinuma, and M. Kawasaki, J. Appl.?Phys., 94, 7768 (2003).?doi: https://doi.org/10.1063/1.1628834 

  26. H. H. Hsieh, T. Kamiya, K. Nomura, H. Hosono, and C. C. Wu,?Appl. Phys. Lett., 92, 133503 (2008).?doi: https://doi.org/10.1063/1.2857463 

  27. G. Zhang, Design and Researches on a-IGZO-Based TFT,?Telecommunication for the Degree of Master of Engineering,?2016. 

  28. K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, and H.?Hosono, Nature, 432, 488 (2004).?doi: https://doi.org/10.1038/nature03090 

  29. A. Sharma, P. G. Bahubalindruni, M. Bharti, and P. Barquinha,?Solid-State Electron., 192, 108273 (2022).?doi: https://doi.org/10.1016/j.sse.2022.108273 

  30. M. Guo, H. Ou, D. Xie, Q. Zhu, M. Wang, L. Liang, F. Liu, C.?Ning, H. Cao, G. Yuan, X. Lu, and C. Liu, Adv. Electron. Mater.,?9, 2201184 (2023).?doi: https://doi.org/10.1002/aelm.202201184 

  31. H. K. Noh, J. S. Park, and K. J. Chang, J. Appl. Phys., 113,?063712 (2013).?doi: https://doi.org/10.1063/1.4792229 

  32. S. J. Park and T. J. Ha, IEEE Electron Device Lett., 44, 642?(2023).?doi: https://doi.org/10.1109/led.2023.3243838 

  33. P. C. Lai, C. L. Lin, and J. Kanicki, IEEE Trans. Electron?Devices, 66, 436 (2019).?doi: https://doi.org/10.1109/ted.2018.2877945 

  34. D. Wang, J. Y. Wan, D. Wang, R. H. Guo, H. M. Zhan, X. Chen,?and X. B. Shao, Chin. J. Liq. Cryst. Disp., 36, 1264 (2021).?doi: https://doi.org/10.37188/cjlcd.2021-0080 

  35. W. Choi, G. Kim, H. Y. Kim, C. Yoo, J. W. Jeon, B. Park, G.?Jeon, S. Jeon, S. Kang, Y. Lee, and C. S. Hwang, ACS Appl.?Electron. Mater., 5, 1721 (2023).?doi: https://doi.org/10.1021/acsaelm.2c01757 

  36. M. M. Hasan, S. Roy, Mohit, E. Tokumitsu, H. Y. Chu, S. C.?Kim, and J. Jang, Appl. Surf. Sci., 611, 155533 (2023).?doi: https://doi.org/10.1016/j.apsusc.2022.155533 

  37. L. Xu, J. Guo, C. Sun, Z. Zheng, Y. Xu, S. Huang, K. Han, W.?Wei, Z. Guo, X. Gong, Q. Luo, L. Wang, and L. Li, IEEE?Electron Device Lett., 44, 412 (2023).?doi: https://doi.org/10.1109/led.2022.3233824 

  38. K. Yang, S. H. Kim, H. W. Jeong, D. H. Lee, G. H. Park, Y. Lee,?and M. H. Park, Chem. Mater., 35, 2219 (2023).?doi: https://doi.org/10.1021/acs.chemmater.2c03379 

  39. S. Knobelspies, A. Daus, G. Cantarella, L. Petti, N.?Munzenrieder, G. Troster, and G. A. Salvatore, Adv. Electron.?Mater., 2, 1600273 (2016).?doi: https://doi.org/10.1002/aelm.201600273 

  40. I. S. Lee, H. Kim, M. K. Park, J. Hwang, R. H. Koo, J. J. Kim,?and J. H. Lee, IEEE Electron Device Lett., 44, 325 (2023).?doi: https://doi.org/10.1109/LED.2022.3229321 

  41. Y. Jeong, H. Kim, J. Oh, S. Y. Choi, and H. Park, J. Electron.?Mater., 52, 3914 (2023).?doi: https://doi.org/10.1007/s11664-023-10386-x 

  42. C. H. Choi, T. Kim, M. J. Kim, S. H. Yoon, and J. K. Jeong,?IEEE Trans. Electron Devices, 70, 2317 (2023).?doi: https://doi.org/10.1109/TED.2023.3261281 

  43. J. Li, Y. Guan, J. Li, Y. Zhang, Y. Zhang, M. Chan, X. Wang,?L. Lu, and S. Zhang, Nanotechnology, 34, 265202 (2023).?doi: https://doi.org/10.1088/1361-6528/acc742 

  44. Y. Guan, Y. Zhang, J. Li, J. Li, Y. Zhang, Z. Wang, Y. Ding, M.?Chan, X. Wang, L. Lu, and S. Zhang, Appl. Surf. Sci., 625,?157177 (2023).?doi: https://doi.org/10.1016/j.apsusc.2023.157177 

  45. B. Li, X. H. Gao, W. T. Zhang, T. Y. Wang, and B. C. Kim,?Comput. Knowl. Technol., 15, 1009 (2019).?doi: https://doi.org/10.14004/j.cnki.ckt.2019.1418 

  46. M. Hu, L. Xu, X. Zhang, H. Hao, S. Zong, H. Chen, Z. Song, S.?Luo, and Z. Zhu, Appl. Phys. Lett., 122, 033503 (2023).?doi: https://doi.org/10.1063/5.0131595 

  47. Y. Magari, T. Kataoka, W. Yeh, and M. Furuta, Nat. Commun.,?13, 1078 (2022).?doi: https://doi.org/10.1038/s41467-022-28480-9 

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