[논문]Effect of Bond Geometry on Shear Strength and HTS Reliability for Au Ball Bond on Al Pad

Gomes, J.; Mayer, M.

doi:10.1109/tcpmt.2015.2512985

Effect of Bond Geometry on Shear Strength and HTS Reliability for Au Ball Bond on Al Pad

IEEE transactions on components, packaging, and manufacturing technology, v.6 no.2, 2016년, pp.306 - 313

Gomes, J. , Mayer, M.

Abstract ▼ AI-Helper

The effect of bond geometry on bond strength and reliability is studied for 25-μm gold wire bonds on standard CMOS aluminum pads. An accelerated method for parameter optimization is used to produce ball bonds with optimized shear strength (SS) and bond geometry. Ball bonds have a diameter of 56.5 μm with a bond height of 12, 16, and 20 μm representing the low, medium, and high bonds, respectively. Low height bonds achieve 126.1 MPa strength and endure up to 41.9% ultrasound (US) before deformation begins, whereas high bonds achieve 109.8 MPa strength and withstand a maximum of 39.8% US. Low bonds achieve higher strengths possibly due to the higher level of US that can be used. Bond reliability is assessed in high-temperature storage tests using a shear test (a destructive method) and piezoresistive stress sensors (a nondestructive method). The bonds are aged at 200°C for ~500 h. Quantifying the reliability performance using shear test results found to be difficult due to poor time resolution. However, from features in the stress sensor signals, a characteristic time (tc) is derived during aging. The tc value indicates the time it takes for the bonds to severely degrade due to intermetallics and crack formation. The tc values for low, medium, and high bonds were found to be 199.9 ± 8.7, 225.9 ± 9.5, and 231.9 ± 6.8 h, respectively. The result that suggests ball bonds with higher heights are more reliable than the bonds with lower heights for a constant ball bond diameter. This result is corroborated by the SS before and after aging being the same for the high bonds, whereas SS dropped by 3% for the low bonds. The nondestructive method was demonstrated to have an estimated time resolution better than 10 h, which allows for precise comparisons of the reliability of various processes.

주제어

참고문헌 (20)

10.1109/EPTC.2004.1396698
Breach, C.D., Wulff, F., Tok, C.W.. An unusual mechanical failure mode in gold ballbonds at 50μm pitch due to degradation at the Au–Au₄Al interface during ageing in air at 175°C. Microelectronics reliability, vol.46, no.2, 543-557.

상세보기
10.1109/ECTC.2015.7159896
Gomes, J., Mayer, M., Lin, B.. Development of a fast method for optimization of Au ball bond process. Microelectronics reliability, vol.55, no.3, 602-607.

상세보기
Rosle, M. F., Abdullah, S., Hamid, M. A. A., Daud, A. R., Jalar, A., Kornain, Z.. Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding. Journal of electronic packaging, vol.132, no.4, 041014-.

상세보기
Woon Yik Yong, Xiaowu Zhang, Tai Chong Chai, Trigg, A., Jaafar, N. B., Guo-Qiang Lo. In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors. IEEE transactions on components, packaging, and manufacturing technology, vol.3, no.2, 328-335.

상세보기
McCracken, Michael James, Koda, Yusuke, Hyoung Joon Kim, Mayer, Michael, Persic, John, June Sub Hwang, Jeong-Tak Moon. Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds. IEEE transactions on components, packaging, and manufacturing technology, vol.3, no.12, 2029-2036.

상세보기
2010
Wire Bonding in Microelectronics harman 2010
10.1109/EPTC.2009.5416580
Novel methods in ball bond reliability using in-situ sensing and on-chip microheaters kim 2013
10.1007/978-1-4757-4254-1
2009
Mayer, M., Moon, J.T., Persic, J.. Measuring stress next to Au ball bond during high temperature aging. Microelectronics reliability, vol.49, no.7, 771-781.

상세보기
10.1109/ECTC.2008.4550219
10.1109/ITHERM.2010.5501278
Maiocco, L., Smyers, D., Munroe, P.R., Baker, I.. Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films. IEEE transactions on components, hybrids, and manufacturing technology, vol.13, no.3, 592-595.

상세보기
Breach, C.D., Wulff, F.. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au₄Al. Microelectronics reliability, vol.44, no.6, 973-981.

상세보기
10.1109/ECTC.2014.6897487
Murcko, R.M., Susko, R.A., Lauffer, J.M.. Resistance drift in aluminum to gold ultrasonic wire bonds. IEEE transactions on components, hybrids, and manufacturing technology, vol.14, no.4, 843-847.

상세보기

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 논문명, 저널/프로시딩명, 저자 , 발행년, 권, 호, 시작페이지, 끝페이지, 발행기관 관리번호, 논문명, 대등논문명, 저자 , 저널/프로시딩명, 발행기관, 발행년, 발행언어, 권, 호, 시작페이지, 끝페이지, ISBN, ISSN, 주제분야, 키워드, 초록(한글), 초록(영문), 저자(소속기관)
저장형식	Text(ASCII format) Excel format RefWorks Direct Export RIS format (for Reference Manager, ProCite, EndNote), Scholar's Aids, Mendeley
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Effect of Bond Geometry on Shear Strength and HTS Reliability for Au Ball Bond on Al Pad

Abstract ▼ AI-Helper

주제어

참고문헌 (20)

이 논문을 인용한 문헌

관련 콘텐츠

원문 URL 링크

연관된 기능

이 논문과 함께 이용한 콘텐츠

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트