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[미국특허] Wafer transfer system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65G-001/00
출원번호 US-0381085 (1982-05-24)
발명자 / 주소
  • Hertel Richard J. (Bradford MA) MacIntosh Edward D. (Gloucester MA)
출원인 / 주소
  • Varian Associates, Inc. (Palo Alto CA 02)
인용정보 피인용 횟수 : 133  인용 특허 : 4

초록

A system for the automated transfer of semiconductor wafers between a cassette and a wafer processing chamber. Included in the system are a cassette conveyor assembly, a wafer transfer assembly and a wafer handling assembly associated with the entrance to the processing chamber. Wafers of any standa

대표청구항

In an automated wafer transfer system, apparatus for accurately positioning a cassette of the type having outwardly extending ribs along opposite sides thereof for access to individual wafers from below by a vertical wafer lift mechanism, said apparatus comprising: a cassette holder comprising a hou

이 특허에 인용된 특허 (4)

  1. Georges Michael P. (P.O. Box 800 Norwood MA 02062), Automatic microscope slide.
  2. Shambelan ; Robert Charles ; Lindsley ; Charles Wesley, Machine for changing the spacing of a plurality of wafers.
  3. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.
  4. Brooks Norman B. (Carlisle MA) Olmstead Michael M. (Bedford MA), Wafer transport system.

이 특허를 인용한 특허 (133)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. Hofmeister, Christopher; Hosek, Martin, Adaptive placement system and method.
  3. Weed, Steven D.; Weed, Allan D., Alignment structure and method for mating a wafer delivery device to a wafer treatment tool.
  4. Lee, Yi-Lung, Ancillary apparatus and method for loading glass substrates into a bracket.
  5. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  6. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  7. Nishi Hironobu (Sagamihara JPX), Apparatus and method for transferring wafers between a cassette and a boat.
  8. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  9. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  10. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  11. Soucy, Alan J.; Castantini, James S., Apparatus and methods for handling semiconductor wafers.
  12. Gaudon, Alain; Astegno, Pierre; El Jarjini, Mohammed, Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark.
  13. Harris,Randy A.; Hanson,Kyle M., Apparatuses and method for transferring and/or pre-processing microelectronic workpieces.
  14. Davis,Jeffry A.; Nelson,Gordon Ray; Bexten,Daniel P., Automated processing system.
  15. Davis, Jeffrey A.; Curtis, Gary L., Automated semiconductor processing system.
  16. Nelson, Gordon Ray; Bexten, Daniel P.; Davis, Jeffry A., Automated semiconductor processing system.
  17. Nelson, Gordon Ray; Bexten, Daniel P.; Davis, Jeffry A., Automated semiconductor processing system.
  18. Davis, Jeffrey A.; Curtis, Gary L., Automated semiconductor processing systems.
  19. Davis,Jeffrey A.; Curtis,Gary L., Automated semiconductor processing systems.
  20. Beer, Emanuel; White, John M., Automated substrate processing system.
  21. Abe Nobutoshi (Kawasaki JPX) Imamura Kazunori (Tokyo JPX), Automatic photomask or reticle washing and cleaning system.
  22. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  23. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  24. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  25. Medico, Louis J., Chuck handling device.
  26. Ernest C. Nichols ; Leo L. Malmin, Jr., Convertible wafer transfer machine.
  27. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
  28. Roman Horst L. (Sterling Heights MI), Dual stroke transfer drive.
  29. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  30. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  31. Kurita Shinichi ; White John M., In-situ substrate transfer shuttle.
  32. Noda Minoru (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Miyata Tsutomu (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Yamashita Yoshihiro (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Ohmura Kenji (31-1 K, Linear transfer device for wafery works.
  33. Patterson Jesse ; Dill Charles Thomas, Low profile automated pod door removal system.
  34. Cowgill, Bruce L., Manipulator constant force spring counterbalance.
  35. Turner Norman L. (Gloucester MA) Pollock John D. (Rockport MA), Method and apparatus for improved ion dose accuracy.
  36. Hayden Thomas J. (2244 Mesa Verde Dr. Milpitas CA 95035), Method and apparatus for orienting semiconductor wafers.
  37. Lu,Zhimin, Method and apparatus to correct water drift.
  38. Astegno, Pierre; Esteve, Ekaterina; Gaudon, Alain, Method and device for changing a semiconductor wafer position.
  39. Astegno,Pierre; Esteve,Ekaterina; Gaudon,Alain, Method and device for changing a semiconductor wafer position.
  40. Ettinger, Gary C.; Khau, Michael E.; Shin, Ho Seon, Methods and apparatus for drying a substrate.
  41. Elliott, Martin R.; Shah, Vinay, Methods and apparatus for mapping carrier contents.
  42. Elliott,Martin R.; Rice,Michael Robert, Methods and apparatus for repositioning support for a substrate carrier.
  43. Berner Robert W. ; Woodruff Daniel J. ; Schmidt Wayne J. ; Coyle Kevin W. ; Zila Vladimir,CAX ; Lund Worm, Modular semiconductor workpiece processing tool.
  44. Berner,Robert W.; Woodruff,Daniel J.; Schmidt,Wayne J.; Coyle,Kevin W.; Zila,Vladimir; Lund,Worm, Modular semiconductor workpiece processing tool.
  45. Robert W. Berner ; Daniel J. Woodruff ; Wayne J. Schmidt ; Kevin W. Coyle ; Vladimir Zila CA; Worm Lund, Modular semiconductor workpiece processing tool.
  46. Takizawa, Masahiro; Suwada, Masaei, Position sensor system for substrate transfer robot.
  47. Shultz Richard E., Programmable substrate support for a substrate positioning system.
  48. Hosek, Martin; Lipcon, Jacob, Robot adaptive placement system with end-effector position estimation.
  49. Dill Charles T., Rotatable wafer handler with retractable stops.
  50. Lee Duk Hee (Kyungsangbuk-do KRX), Semiconductor device transfer apparatus.
  51. Hanson Kyle ; Dix Mark ; Zila Vladimir,CAX ; Woodruff Daniel J., Semiconductor processing apparatus having lift and tilt mechanism.
  52. Hanson, Kyle; Dix, Mark; Zila, Vlad; Woodruff, Daniel J., Semiconductor processing apparatus having lift and tilt mechanism.
  53. Hanson, Kyle; Dix, Mark; Zila, Vladimir; Woodruff, Daniel J., Semiconductor processing apparatus having lift and tilt mechanism.
  54. Hanson,Kyle; Dix,Mark; Zila,Vlad; Woodruff,Daniel J., Semiconductor processing apparatus having lift and tilt mechanism.
  55. Hanson, Kyle; Dix, Mark; Woodruff, Daniel J.; Schmidt, Wayne J.; Coyle, Kevin W., Semiconductor processing apparatus having linear conveyer system.
  56. Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G. ; Byle Darryl S., Semiconductor processing system with wafer container docking and loading station.
  57. Thompson, Raymon F.; Berner, Robert W.; Curtis, Gary L.; Culliton, Stephen P.; Wright, Blaine G.; Byle, Darryl S., Semiconductor processing system with wafer container docking and loading station.
  58. Thompson, Raymond F.; Berner, Robert W.; Curtis, Gary L.; Culliton, Stephen P.; Wright, Blaine G., Semiconductor processing system with wafer container docking and loading station.
  59. Thompson Raymon F. (Kalispell MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kalispell MT) Culliton Stephen P. (Bozeman MT) Wright Blaine G. (Kalispell MT), Semiconductor processing systems.
  60. Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor processing systems.
  61. Bergman Eric J. ; Berner Robert W. ; Oberlitner David, Semiconductor processing using vapor mixtures.
  62. Butler Robert M. (Tempe AZ), Semiconductor wafer diffusion boat and method.
  63. Raaijmakers, Ivo, Semiconductor wafer position shift measurement and correction.
  64. Raaijmakers,Ivo, Semiconductor wafer position shift measurement and correction.
  65. Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor wafer processing system.
  66. Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor wafer processing system with immersion module.
  67. Lau John J. (13350 Floyd Cir. Dallas TX 75243), Semiconductor wafer transfer apparatus.
  68. Howells John ; Peltola Randall W., Semiconductor wafer transfer method and apparatus.
  69. Nishi Hironobu (Sagamihara JPX) Yamaga Kenichi (Sagamihara JPX) Asano Takanobu (Yokohama JPX) Sawado Kazutoshi (Sagamihara JPX) Fumoto Masashi (Sagamihara JPX) Ito Shozo (Sagamihara JPX) Mochizuki Yo, Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer.
  70. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
  71. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in vacuum tank.
  72. White, John M.; Turner, Norman L.; Tiner, Robin L.; Keller, Ernst; Kurita, Shinichi; Blonigan, Wendell T.; Berkstresser, David E., Substrate transfer shuttle.
  73. Cheng David (San Jose CA) Zhang Wesley W. (Burlingame CA), System and method for detecting the center of an integrated circuit wafer.
  74. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  75. Stonestreet Paul (Cowfold GB2) Allum Clive (Crawley GB2) Webber Bert (Crawley GB2) Cooke Richard (West Worthing GB2) Robinson Frederick J. L. (Crawley GB2) Wauk ; II Michael T. (Haywards Heath GB2), Systems and methods for wafer handling in semiconductor process equipment.
  76. Kim, Se Yong; Kim, Woo Chan; Jung, Dong Rak, Thin film deposition apparatus and method of maintaining the same.
  77. Kim, Ki Jong; Kim, Dae Youn, Thin film deposition apparatus and method thereof.
  78. Kobayashi, Kenji, Transferring device and transferring method.
  79. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Transferring device for a vacuum processing apparatus and operating method therefor.
  80. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  81. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  82. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  83. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  84. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  85. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method using a vacuum chamber.
  86. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method with wafers, substrates and/or semiconductors.
  87. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  88. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  89. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  90. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  91. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  92. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  93. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  94. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  95. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  96. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  97. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  98. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  99. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  100. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  101. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  102. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  103. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  104. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  105. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  106. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  107. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  108. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  109. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  110. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  111. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  112. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  113. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  114. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  115. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  116. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  117. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  118. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  119. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  120. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  121. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  122. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  123. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing equipment configuration.
  124. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing equipment configuration.
  125. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  126. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  127. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  128. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX), Vacuum slice carrier.
  129. Hine Derek L. (5 Hawk View Portola Valley CA 94025), Wafer alignment and transport mechanism.
  130. Yuen, Jean-Hua; Chen, Po-Ming; Chiang, Ming-Ji; Yang, Ji-Shen, Wafer edge detector.
  131. Howells John ; Gorman Andrew P. ; Peltola Randall W., Wafer handling system and method.
  132. Takahashi Kazue (Kudamatsu JPX), Wafer transfer apparatus and method.
  133. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
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