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NTIS 바로가기IEEE transactions on components, packaging, and manufacturing technology, v.6 no.2, 2016년, pp.306 - 313
Gomes, J. , Mayer, M.
The effect of bond geometry on bond strength and reliability is studied for 25-μm gold wire bonds on standard CMOS aluminum pads. An accelerated method for parameter optimization is used to produce ball bonds with optimized shear strength (SS) and bond geometry. Ball bonds have a diameter of ...
Breach, C.D., Wulff, F., Tok, C.W.. An unusual mechanical failure mode in gold ballbonds at 50μm pitch due to degradation at the Au–Au4Al interface during ageing in air at 175°C. Microelectronics reliability, vol.46, no.2, 543-557.
Gomes, J., Mayer, M., Lin, B.. Development of a fast method for optimization of Au ball bond process. Microelectronics reliability, vol.55, no.3, 602-607.
Rosle, M. F., Abdullah, S., Hamid, M. A. A., Daud, A. R., Jalar, A., Kornain, Z.. Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding. Journal of electronic packaging, vol.132, no.4, 041014-.
Woon Yik Yong, Xiaowu Zhang, Tai Chong Chai, Trigg, A., Jaafar, N. B., Guo-Qiang Lo. In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors. IEEE transactions on components, packaging, and manufacturing technology, vol.3, no.2, 328-335.
McCracken, Michael James, Koda, Yusuke, Hyoung Joon Kim, Mayer, Michael, Persic, John, June Sub Hwang, Jeong-Tak Moon. Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds. IEEE transactions on components, packaging, and manufacturing technology, vol.3, no.12, 2029-2036.
2010
Wire Bonding in Microelectronics harman 2010
Novel methods in ball bond reliability using in-situ sensing and on-chip microheaters kim 2013
2009
Mayer, M., Moon, J.T., Persic, J.. Measuring stress next to Au ball bond during high temperature aging. Microelectronics reliability, vol.49, no.7, 771-781.
Maiocco, L., Smyers, D., Munroe, P.R., Baker, I.. Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films. IEEE transactions on components, hybrids, and manufacturing technology, vol.13, no.3, 592-595.
Breach, C.D., Wulff, F.. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. Microelectronics reliability, vol.44, no.6, 973-981.
Murcko, R.M., Susko, R.A., Lauffer, J.M.. Resistance drift in aluminum to gold ultrasonic wire bonds. IEEE transactions on components, hybrids, and manufacturing technology, vol.14, no.4, 843-847.
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